Section III. MAINTENANCE PROCEDURES
The individual maintenance procedures in this section contain the corrective actions required to fix a failure which was
isolated during troubleshooting.
14-16. EQUIPMENT HANDLING PRECAUTIONS
As with most data processing equipment, the line printer is very sensitive to dirt, dust, and even smoke. Follow the rules
below to avoid damage to the equipment.
Make sure hands, hair, clothing, and shoes are clean before working on the line printer.
Do not touch board connector terminals with any tool, bare hands, or dirty cloth. Tools will damage the fragile
connector. Dirt or body sweat will cause corrosion.
Hold boards by their edges whenever you lift them.
d. If a board will be transported, place it in a sturdy box to protect it.
Pack it carefully with clean packing material that will prevent physical damage and will not cause corrosion.
Ground your body to discharge static electricity by touching a metal chassis or cabinet before touching a
board. A static discharge from you to a board can destroy integrated circuits on a board.
Do not put beverages on or near boards. An accidental spill can cause corrosion and chemical damage. It
can also cause circuits to short out.
Do not allow food on or near boards. Crumbs and greasy residues can lead to chemical damage and
Never leave boards lying around unprotected.
4-17. MAINTENANCE PROCEDURES
The following paragraphs contain the inspection, removal, installation, and testing procedures for the line printer. Repair of
the line printer is limited to replacement of its subassemblies and components. Therefore, the following tasks contain step-
by-step procedures for replacement of each subassembly and component only as authorized by the Maintenance
Allocation Chart (MAC). Inspection of subassemblies and components during cleaning, removal, and installation consists
of commonly accepted standard procedures for electronic equipment, except where included as part of the replacement
procedures. Subassembly and component testing, except where included as part of a test or a procedure, consists of the
satisfactory operation of the subassembly or component as a part of the overall assembly.